WanSin
WanSin
WanSin specializes in UF resin for E0 wood flooring substrate production: pH 7.5, 55% solids, 1.25 t IBC tote packaging, with stable formulation, timely supply and custom support.
Built around the real adhesive needs of E0 wood flooring substrate production, so every batch of UF resin is stable, usable and keeps pace with your line.
Key raw materials are sourced from designated suppliers, with traceable batch stability, reducing the risk of delamination and blistering at source.
Careful control of free formaldehyde content to meet the environmental requirements of panels for adhesives.
Formulation sampling and parameter tuning based on your substrate, equipment and hot-press conditions to fit your actual line.
Developed specifically for E0 wood flooring substrate production, with stable key indicators and compatibility with mainstream hot-press processes.
E0 · Substrate Grade
For E0 flooring substrate · 1.25 t/container
Used for bonding E0 wood flooring substrate (multi-layer substrate, blockboard substrate, etc.): high bond strength, stable curing, excellent free-formaldehyde control, compatible with mainstream hot-press lines.
The following parameters come from the product label for purchasing and process reference.
| Parameter | Specification |
|---|---|
| Product Name | WanSin UF resin for E0 wood flooring substrate |
| Appearance | Milky white to light yellow viscous liquid |
| pH Value | 7.5 |
| Solids Content | 55% |
| Packaging | 1.25 t / container (IBC tote) |
| Shelf Life | 30 days |
| Applications | E0 wood flooring substrate production (multi-layer substrate, blockboard substrate, etc.) |
| Hot-press Process | Reference temperature 100–120℃; pressure and time adjusted to the board process |
Follow the process points suggested on the product label for a stable bonding result.
Bonding surfaces should be dry, free of oil and dust.
Add flour as per process requirements and mix well before use.
Spray, brush or roll to apply, keeping an even glue line.
Reference temperature 100–120℃; pressure and time adjusted to the board process.
Bonding for multi-layer substrate and blockboard substrate, meeting E0 environmental requirements.
Interlayer bonding with high bond strength for a flat, structurally stable substrate.
Compatible with mainstream hot-press processes; reference temperature 100–120℃ for flat boards.
A standardized process ensures every batch of raw material is stable and reliable.
Formulas designed to process needs, tested and verified repeatedly
Strict sampling of incoming materials to control quality at source
Automated line production with traceable batch samples
Re-inspection before shipment; delivered promptly once qualified
Careful control of free formaldehyde content
Retained samples per batch for issue tracing
Samples first, parameters adjustable
Capacity secured, delivery on time
Guilin WanSin New Materials Co., Ltd. is a subsidiary of Guilin Wanli Adhesive Co., Ltd. The company specializes in industrial formaldehyde solution and high-end urea-formaldehyde and melamine-formaldehyde synthetic resins, focused on the R&D, production and supply of UF resin for E0 wood flooring substrate.
Located northeast of Lingchuan county seat, Guilin, Guangxi — about 2.5 km from the county and 10 km from downtown Guilin, along the Guihuang Highway — the plant covers about 14,000 m² with about 9,500 m² of buildings, and operates one formaldehyde production line with an annual capacity of 60,000 tonnes.
The formaldehyde workshop line is controlled by DCS computerized automation; the synthetic resin workshop is equipped with 7 sets of production equipment and 2 sets of drying equipment, using standardized processes to ensure every batch of UF resin is stable and reliable and keep flooring substrate producers running efficiently.
